93 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series sp03-6 (s0-8) description features applications this new broadband protection device from littelfuse provides overvoltage protection for applications such as 10/100/1000 baset ethernet, t3/e3 ds3 interfaces, adsl2+, and vdsl2+. this new protector combines the tvs diode element with a diode recti?er bridge to provide both longitudinal and differential protection in one package. this design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. this reduces intermodulation (im) distortion caused by a typical solid-state protection solution. the application schematic provides the connection information. pinout functional block diagram sp03-6 (so-8) series rohs pb green agency approvals - pending agency agency file number e128662 t 3 p ) 4 d p n q m j b o u t . 4 t v s g b d f n p v o u package (jedec so-8) t - p x j o t f s u j p o m p t t
m p h linear capacitance t $ p n c j o f e m p o h j u v e j o b m and metallic protection t $ m b n q j o h t q f f e p g nanoseconds t 6 - 7 f q p y z n p m e j o h t 1 f o e j o h 6 - s f d p h o j [ f e component t - p x d m b n q j o h w p m u b h f t 5 & - j o f d b s e t t 5 & b o e % 4 * o u f s g b d f t t 4 5 4 * o u f s g b d f t t # b t f 5 ethernet so-8 (top view) 1 2 3 5 4 6 7 8 pin 1 and 8 pin 4 and 5 ground pin 2, 3, 6, and 7 line out line out line in line in
94 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series absolute maximum ratings parameter rating units peak pulse current (8/20s) 150 a peak pulse power (8/20s) 2800 w iec 61000-4-2, direct discharge, ( level 4) 30 kv iec 61000-4-2, air discharge, ( level 4) 30 kv iec 61000-4-5 (8/20s) 100 a telcordia gr 1089 (intra-building) (2/10s) 100 a itu k.20 (5/310s) 40 a electrical characteristics (t op = 25c) thermal information parameter rating units soic package 170 c/w operating temperature range -55 to 125 c storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) (soic - lead tips only) 300 c parameter symbol test conditions min typ max units reverse stand-off voltage v rwm ---6v reverse breakdown voltage v br i t = 1ma 6.8 - - v reverse leakage current i r v rwm = 6v, t= 25c - - 25 a clamping voltage, line-ground v c i pp = 50a, t p =8/20 s - - 15 v clamping voltage, line-ground v c i pp = 100a, t p =8/20 s - - 20 v junction capacitance c j between i/o pins and ground v r =0v, f= 1mhz -1625pf between i/o pins v r =0v, f= 1mhz -812pf caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed.
95 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series sp03-6 (s0-8) figure 2: current derating curve figure 4: clamping voltage vs. peak pulse current figure 6: forward voltage vs. forward current figure 1: non-repetitive peak pulse current vs. pulse time figure 3: pulse waveform figure 5: capacitance vs. reverse voltage pulse decay time (s) 1 10 100 1000 1 10 100 1000 peak pulse current (a) time, s 0 20 40 60 80 100 0 5 10 15 20 25 30 35 40 percentage of i pp (%) capacitance (pf) reverse voltage (v) 0 2 4 6 8 10 12 14 16 18 20 01234567 line-to-line line-to-ground percentage of rated current (%i p ) ambient temperature (c) 0 20 40 60 80 100 120 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25 020406080100 v c clamping voltage (v) i p peak impulse current (a) line-to-line line-to-ground 0 1 2 3 4 5 6 7 0 102030405060708090100 forward current (a) forward voltage (v) ground-to-line
96 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series application example the following schematic shows a high-speed data interface protection solution. the sp03-6 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events. its surge rating is compatible with the intra-building surge requirements of telcordias gr-1089-core, and the basic level recommendations of itu k.20 and .21. this device protects against both positive and negative induced surge events. the telelink fuse provides overcurrent protection for the long term 50/60 hz power fault events. 1 2 3 4 8 7 6 5 to chipset (ethernet phy, t3/e3 phy, etc.) ring tip telelink (0461 1.25) sp03-6 re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5 c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 2 5 c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters
97 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series sp03-6 (s0-8) part numbering system product characteristics ordering information part number package marking min. order qty. SP03-6BTG soic tape & reel sp03-6 2500 lead plating matte tin lead material copper alloy lead coplanarity 0.004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 series package b = soic, 2500 quantity silicon protection array SP03-6BTG t = tape & reel g = green part marking system package dimensions - mechanical drawings and recommended solder pad outline package ms-012 (so-8) pins 8 jedec mo-223 issue a millimetres inches min max min max a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 a2 1.25 1.65 0.043 0.065 b 0.31 0.51 0.012 0.020 c 0.017 0.25 0.007 0.010 d 4.80 5.00 0.189 0.197 e 5.80 6.20 0.228 0.244 e1 3.80 4.00 0.150 0.157 e 1.27 bsc 0.050 bsc l 0.40 1.27 0.016 0.050 o recommended soldering pad outline (reference only) f l first line: part number second line: date code f l sp03-6 xxxxxxxx notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13.
98 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance tvs protection for high-speed data interfaces sp03-6 (so-8) series embossed carrier tape & reel speci?cation - soic package millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 5.4 5.6 0.213 0.22 p2 1.95 2.05 0.077 0.081 d 1.5 1.6 0.059 0.063 d1 1.50 min 0.059 min p0 3.9 4.1 0.154 0.161 10p0 40.0 +/- 0.20 1.574 +/- 0.008 w 11.9 12.1 0.468 0.476 p 7.9 8.1 0.311 0.319 a0 6.3 6.5 0.248 0.256 b0 5.1 5.3 0.2 0.209 k0 2 2.2 0.079 0.087 t 0.30 +/- 0.05 0.012 +/- 0.002 dimensions
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